Shenzhen Danbond Technology Co.Ltd(002618) CNY 2.5

Dividend Yield(TTM) =0.00%

Year	Yield	Total	Amount	Ex Date
2020	0.12%	CNY 0.003	CNY0.003	2020-10-09
2019	0.20%	CNY 0.005	CNY0.005	2019-07-12
2018	0.20%	CNY 0.005	CNY0.005	2018-08-02
2017	0.19%	CNY 0.005	CNY0.00467	2017-06-16
2016	0.49%	CNY 0.012	CNY0.01233	2016-05-30
2015	0.67%	CNY 0.017	CNY0.01667	2015-06-30
2014	0.39%	CNY 0.01	CNY0.00967	2014-06-26
2013	0.47%	CNY 0.012	CNY0.01167	2013-06-28
2012	0.47%	CNY 0.012	CNY0.01167	2012-06-19